Systems in packages including wide-band phased-array antennas and methods of assembling same

ABSTRACT

A system-in-package includes a package substrate that at least partially surrounds an embedded radio-frequency integrated circuit chip and a processor chip mated to a redistribution layer. A wide-band phased-array antenna module is mated to the package substrate with direct interconnects from the radio-frequency integrated circuit chip to antenna patches within the antenna module. Additionally, fan-out antenna pads are also coupled to the radio-frequency integrated circuit chip.

PRIORITY APPLICATION

This application is a divisional of U.S. application Ser. No.16/019,023, filed Jun. 26, 2018, which claims the benefit of priority toMalaysian Application Serial Number PI 2017704783, filed. Dec. 13, 2017,all of which are incorporated herein by reference in their entirety.

FIELD

This disclosure relates to semiconductor device packages that includewide-band communications arrays.

BACKGROUND

Semiconductive device miniaturization during packaging includeschallenges to locate radio-frequency antennas close to the activedevices, and the act of miniaturizing the antennas to keep pace withsemiconductor device miniaturization.

BRIEF DESCRIPTION OF THE DRAWINGS

Disclosed embodiments are illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings where likereference numerals may refer to similar elements, in which:

FIG. 1A is a cross-section elevation of a wafer-level fabricated fan-outsemiconductor device package during fabrication of a system-in-packagethat includes a phased-array antenna module according to an embodiment;

FIG. 1B is a cross-section elevation of the semiconductor device packagedepicted in FIG. 1A after further processing according to an embodiment;

FIG. 1C is a cross-section elevation of the semiconductor device packagedepicted in FIG. 1B after further processing according to an embodiment;

FIG. 1D is a cross-section elevation of the semiconductor device packagedepicted in FIG. 1C after further processing according to an embodiment;

FIG. 1E is a cross-section elevation of the semiconductor device packagedepicted in FIG. 1D after further processing according to an embodiment;

FIG. 1F is a cross-section elevation of the semiconductor device packagedepicted in FIG. 1E, and taken at a different cross section (X′-Z′ inthe Y-coordinate direction out of the plane of FIG. 1E) according to anembodiment;

FIG. 1G is a cross-section elevation of the semiconductor device packagedepicted in FIG. 1E after further processing according to an embodiment;

FIG. 1H is a top plan of the semiconductor device package depicted inFIG. 1G according to an embodiment;

FIG. 2A is a cross-section elevation of a phased-array antenna moduleaccording to an embodiment;

FIG. 2B is a cross-section elevation of the phased-array antenna moduledepicted in

FIG. 2A after further processing according to an embodiment;

FIG. 2C is a cross-section elevation of the phased-array antenna moduledepicted in FIG. 2B after further processing according to an embodiment;

FIG. 2D is a cross-section elevation of the phased-array antenna moduledepicted in FIG. 2C after further processing according to an embodiment;

FIG. 2E is a cross-section elevation of the phased-array antenna moduledepicted in FIG. 2D after further processing according to an embodiment;

FIG. 2F is a top plan of a general depiction of the phased-array antennamodule depicted in FIG. 2E according to an embodiment;

FIG. 2G is a cross-section elevation of the phased-array antenna moduledepicted in FIG. 2E after further processing according to an embodiment;

FIG. 3 is a cross-section elevation of a wafer-level fan-out packagewith wide-band phased array antennas according to an embodiment;

FIG. 4 is a process flow diagram according to an embodiment;

FIG. 5 is a top plan of a system-in-package that is configured to matewith a wideband phased-array antenna module according to an embodiment;and

FIG. 6 is included to show an example of a higher-level deviceapplication for the disclosed embodiments.

DETAILED DESCRIPTION

A radio-frequency (RF) antenna in a semiconductor device package islocated close to the active devices with designs that minimize RF lossthrough shortened semiconductor-package routing and RF device noiseshielding. Packaged antenna arrays with the semiconductor device packageembodiments are configured in a form factor to facilitate minimized RFloss and useful interconnections between the semiconductor devicepackage and the antenna array package.

FIG. 1A is a cross-section elevation of a wafer-level fabricated fan-outsemiconductor device package 101 during fabrication of asystem-in-package that includes a phased-array antenna module accordingto an embodiment. In an embodiment, a processor die 110 including atransistor active area 112 and a radio-frequency integrated circuit(RFIC) die 114 with a transistor active area 114 are seated onto acarrier 118 by an adhesive layer 120. The processor die 110 is seatedwith the active area 112 facing the carrier 118, and the RFIC die 114 isseated with the active area 116 facing away from the carrier 118. Theactive area 112 of the processor die 110 is disposed opposite andparallel planar with a processor die backside surface 113. With respectto the RFIC die, the active area 116 may be referred to as the RFICfirst surface 116, and the surface opposite and parallel planar with theRFIC first surface 116 may be referred to as the RFIC die backsidesurface 117. In an embodiment, the active surface may be referred to asa first surface and the backside surface may be referred to as a secondsurface.

In an embodiment, the carrier 118 is an organic carrier such as a FR4board. In an embodiment, the carrier 118 is a silicon carrier such as asilicon wafer. In an embodiment, the carrier 118 is an inorganic carriersuch as a glass panel.

FIG. 1B is a cross-section elevation of the semiconductor device package101 depicted in FIG. 1A after further processing according to anembodiment. The semiconductor device package 102 has been overmolded bya cover 122 to enclose the processor die 110 and the RFIC die 114. In anembodiment, the cover 122 is an organic compound that is useful forpatterning electrical traces on one surface of the cover 122. In anembodiment, the cover 122 is an organic compound that is useful fortrench drilling for useful electrical connections. In an embodiment, thecover 122 is an organic compound that is useful for trench forming foruseful electronic shielding.

FIG. 1C is a cross-section elevation of the semiconductor device package102 depicted in FIG. 1B after further processing according to anembodiment. The semiconductor device package 103 has been inverted, asindicated by the negative-Z coordinate, and the carrier 110 and adhesive120 (see FIGS. 1A and 1B) have been removed.

In an embodiment, a redistribution layer (RDL) 124 have been formed tocouple directly with the processor die 110, but not directly with theRFIC die 114. In an embodiment, the RDL 124 includes at least onereference voltage (VSS), or ground trace 126 that is coupled to theprocessor die 110. In an embodiment, an RFIC VSS trace 128 isconstructed near the RFIC die 114, and the RFIC trace 128 is configuredto carry the same reference voltage as the VSS trace 126.

As illustrated, the RDL 124 exhibits three dielectric layers includingat least two trace layers, and bond pads 125 connected to the dielectriclayer farthest from the cover 122. Other RDL configurations may beselected according to a useful application for a given semiconductordevice package embodiment.

FIG. 1D is a cross-section elevation of the semiconductor device package103 depicted in FIG. 1C after further processing according to anembodiment. The semiconductor device package 104 has been processed toform a solder-paste electrical-hump array 130 in bond-pad opens in theRDL 124 that includes a land side 131 of the RDL 124. In an embodiment,formation of the electrical-hump array 130 is carried out later inprocessing after further action on the cover 122.

FIG. 1E is a cross-section elevation of the semiconductor device package104 depicted in FIG. 1D after further processing according to anembodiment. The semiconductor device package 105 has been re-inverted,as indicated by the positive-Z coordinate, and the cover 122 has beenselectively opened. In an embodiment, a through-mold via 132 has beenformed in the cover 122 to expose a contact that is coupled to thereference-voltage trace 126. In an embodiment, a through-mold trench 134has been opened around the RFIC die 114 in preparation for a shieldingwall. Additionally, recesses 136 have been opened in the cover 122 toexpose bond pads associated with the active area 116 of the RFIC die114.

FIG. 1F is a cross-section elevation of the semiconductor device package105 depicted in FIG. 1E, and taken at a different cross section (X′-Z′in the Y-coordinate direction, out of the plane of FIG. 1E) according toan embodiment. The semiconductor device package 106 has been processed,not only to open the through-mold via 132 and the through-mold trench134 (depicted in ghosted lines with the center occurrence), an RFICthrough-mold via 138 has been opened in the cover 122, and an RFICcommunication trace 140 has been patterned on the cover 122 to allowcommunication between the RFIC die 114 and the processor die 110 throughthe RDL 124.

FIG. 1G is a cross-section elevation of the semiconductor device package105 depicted in FIG. 1E after further processing according to anembodiment. The semiconductor device package 107 has been processed byfilling the through-mold via 132, the RFIC through-mold via 138 (seeFIG. 1F) and the through-mold trench 134 with solder paste. In anembodiment, an electrical bump 142 is applied to the through-mold via132. Similarly, electrical bumps 144 are applied to the through-moldtrench 134 where a breach in the cover 122 exposes the through-moldtrench 134. Additionally, a series of electrical bumps 146 is applied tothe RFIC die 114 where bond pads have been exposed through the cover122. Under some handling condition embodiments, the solder-pasteelectrical-bump array 130 is reflowed at a time different from formingthe several electrical bumps 142, 144 and 146.

In an embodiment, a communication trace such as the communication trace140, depicted in FIG. 1F, is not used. In an embodiment, athrough-silicon via 141 is used that allows electrical communication topass vertically in the negative-Z direction beyond the RFIC trace 128and into the RDL 124, such that electrical communication has a shorterpath into the RDL 124 than over top of the through-mold trench 134.

FIG. 1H is a top plan of the semiconductor device package 107 depictedin FIG. 1G according to an embodiment. The view from FIG. 1G is takenfrom FIG. 1H along the section line G-G. The cover 122 obscures theprocessor die 110 as well as the RFIC die 114 and the through-moldtrench 134, all of which are depicted in ghosted lines. The severalelectrical bumps 142, 144 and 146 protrude through breaches in thecover.

As illustrated, the through-mold trench 134 forms a shielding wall 134to separate the RFIC die 114 from the processor die 110, bothelectrically and with electromagnetic interference (EMI).

When the semiconductor device package 107 has been assembled, it ismated to a phased-array antenna module. In an embodiment, thesemiconductor device package 107 is at least part of a system-in-package(SIP) that is mated to a phased-array antenna module.

FIG. 2A is a cross-section elevation of a phased-array antenna module201 according to an embodiment. An array workpiece such as a siliconsubstrate 210 (or any useful semiconductive core) has been repeatedlydrilled to form a plurality of through-holes 212. Drilling isaccomplished by a mechanical drill in an embodiment. Drilling may alsobe done by a laser drill tool.

FIG. 2B is a cross-section elevation of the phased-array antenna module201 depicted in FIG. 2A after further processing according to anembodiment. The phased-array antenna module 202 has been metallicallyplated with a plating layer 214 such as a copper layer in an embodiment.Plating is accomplished with an electroplating process where a cathodiccharge is applied to the silicon substrate 210, and metallic layer, suchas a copper film 214 results as the plating layer 214.

FIG. 2C is a cross-section elevation of the phased-array antenna module202 depicted in FIG. 2B after further processing according to anembodiment. The phased-array antenna module 203 has been mechanicallypolished by top grinding to remove substantially all the plating layer214 from the top surface 216 in further preparation to fabricate antennaelements above the top surface 216. The plating layer 214 remains withinthe through-holes 212 as well as on the bottom surface 218.

FIG. 2D is a cross-section elevation of the phased-array antenna module203 depicted in FIG. 2C after further processing according to anembodiment. The phased-array antenna module 204 has been processed bycovering the silicon substrate 210 and the remaining plating layer 214with a first dielectric layer 220. In an embodiment, the through-holes212 are re-opened by a drilling process under conditions to electricallyinsulate the plating layer 214 within the through-holes 212. In anembodiment, the through-holes 212 are re-opened by an etching process.In an embodiment, source- or ground-contact recesses 222 are opened inthe first dielectric layer 220 at the bottom side 218 of thesemiconductor substrate 210.

FIG. 2E is a cross-section elevation of the phased-array antenna module204 depicted in FIG. 2D after further processing according to anembodiment. The phased-array antenna module 205 has been processed byplating source contacts 224 into the source-contact recesses 222 (seeFIG. 2D). After plating the source contacts 224, plating is further doneto form vertical-line interconnects 226. The vertical-line interconnects226 include bottom contact pads 228 and direct-contact antenna pads 230.Additionally, fan-out antenna pads 232 are also plated onto the firstdielectric layer 220. Plating is done in an embodiment by patterning amask on the first dielectric layer 220 and plating onto and through thefirst dielectric layer 220. In connection with the vertical-lineinterconnect bottom contact pads 228, a voltage source trace 234 is alsoplated to be coupled to the plating layer 214 through the plating sourcecontacts 224.

FIG. 2F is a top plan of a general depiction of the phased-array antennamodule 205 depicted in FIG. 2E according to an embodiment. The view fromFIG. 2F is taken generally from FIG. 2E along the section line E-E.Formation of the direct-contact antenna pads 230 are illustrated withthe vertical-line interconnects 226 located in the center of thedirect-contact antenna pads 230. Where allowed by a given application ofthe technology, the vertical-line interconnect 226 allows for in-situcontact within the direct-contact antenna pads 230. Formation of thefan-out antenna pads 232 is illustrated where routing from a contactpoint 236 that is not central to the fan-out antenna pads.

FIG. 2G is a cross-section elevation of the phased-array antenna module205 depicted in FIG. 2E after further processing according to anembodiment. The phased-array antenna module 206 has been processed byforming a protection layer 238 above the antenna elements 230 and 232.In an embodiment, a solder-resist layer 240 is formed to mostly coverthe bottom contact pads 228 and the source trace 234, with solder-resistopens (SROs) 244 and 246 to expose selected respective source trace 234and vertical-line interconnect bottom contact pads 228.

FIG. 3 is a cross-section elevation of a wafer-level fan-out packagewith a wide-band phased-array antenna module 300 according to anembodiment. The semiconductor device package 107 as depicted generallyin FIG. 1G, is the base for the phased-array antenna module 206 depictedgenerally in FIG. 2G.

Signal integrity that is generated within the RFIC die 114 is useful asit is propagated through the vertical-line interconnects 226 from theRFIC die 114. With the presence of the plating layer 214 as it shieldsthe vertical-line interconnect 226, it is also coupled to the voltagesource (ground) for the entire wafer-level fan-out package with awide-band phased array antenna module 300. Further as illustrated inFIG. 3, the RFIC trace 128 along with the through-mold trench 134,creates a shielding structure around the RFIC DIE 114 to further enablesignal integrity for the phased array antenna elements and to reduceelectromagnetic interference (EMI) to the processor die 110. Withseveral occurrences of RFIC traces 128 (into and out of the plane of thedrawing), the through-mold trench 134 forms an EMI shielding basin intowhich the RFIC die 114 is embedded.

In an embodiment, a board 350 such as a motherboard 350 is mated to theelectrical-bump array 130. In an embodiment, the board 350 is protectedby an external shell 352 that allows for the board 350 to be near orintegral to an external structure 352 of a computing system.

FIG. 4 is a process flow diagram 400 according to an embodiment.

At 410, the process includes forming a semiconductor device package thatcontains a processor die and a shielded radio-frequency integratedcircuit (RFIC) die. The term “shielded” means physically and at leastpartially surrounded, and some blockage of interfering signal noise iseffected.

At 412, the process allows the processor die and the RFIC die areconfigured side-by-side with one having the first surface facingopposite the other.

At 414, the process allows the processor die to be coupled directly to aredistribution layer (RDL) and the RFIC die is coupled indirectly to theRDL. Where the processor die is facing the RDL in flip-chip style, theRFIC die may be coupled by a TSV, or it may be coupled by at least onetrace that breaches the through-mold trench.

At 420, the process includes forming a wafer-level fan-out phased-arrayantenna module.

At 422, the process allows for forming vertical-line interconnects toantenna patches through a substrate, and routed interconnects to antennapatches.

At 424, the process allows the vertical-line interconnects to be formedby shielding them with the ground source structure, which is the platinglayer.

At 430, the process includes assembling the phased-array antenna moduleto the semiconductor device package.

At 440, the process includes assembling the wafer-level fan-out packageto a board at the semiconductor package substrate at a land side.

At 450, the process includes assembling the system-in-package andwide-band phased-array antenna module to a computing system,

FIG. 5 is a top plan of a system-in-package 500 that is configured tomate with a wide-band phased-array antenna module according to anembodiment. The view from FIG. 5 analogous to at least part of the viewof Figure with additional devices to achieve a specificsystem-in-package. A cover 522 obscures a processor die 510 as well asan RFIC die 514 and a through-mold trench 534, all of which are depictedin ghosted lines. Several electrical bumps 542, 544 and 546 protrudethrough breaches in the cover 522.

As illustrated, the through-mold trench 534 forms a shielding wall 534to separate the RFIC 514 from other active devices. For example, thethrough-mold trench 534 separates the RFIC 514 from the processor die510, as well as other devices including a memory module 504. In anembodiment, a platform-controller hub (PCH) 506 is disposed beneath thecover 522. In an embodiment, a memory-controller hub (MCH) 508 isdisposed near the memory module 504.

When the system in package 500 has been assembled, it is mated to awide-band phased-array antenna module with the several electrical bumps542.

FIG. 6 is included to show an example of a higher-level deviceapplication for the disclosed embodiments. The system-in-package with awide-hand phased-array antenna module apparatus embodiments may be foundin several parts of a computing system. In an embodiment, thesystem-in-package with a wide-band phased-array antenna module apparatusis part of a communications apparatus such as is affixed to a cellularcommunications tower. The system-in-package with a wide-bandphased-array antenna module apparatus may also be referred to as asystem-in-package with a wide-band phased-array antenna apparatus. In anembodiment, a computing system 400 includes, but is not limited to, adesktop computer. In an embodiment, a system 400 includes, but is notlimited to a laptop computer. In an embodiment, a system 400 includes,but is not limited to a netbook. In an embodiment, a system 400includes, but is not limited to a tablet. In an embodiment, a system 400includes, but is not limited to a notebook computer. In an embodiment, asystem 400 includes, but is not limited to a personal digital assistant(PDA). In an embodiment, a system 400 includes, but is not limited to aserver. In an embodiment, a system 400 includes, but is not limited to aworkstation. In an embodiment, a system 400 includes, but is not limitedto a cellular telephone. In an embodiment, a system 400 includes, but isnot limited to a mobile computing device. In an embodiment, a system 400includes, but is not limited to a smart phone. In an embodiment, asystem 400 includes, but is not limited to an Interne. appliance. Othertypes of computing devices may be configured with the microelectronicdevice that includes system-in-package with a wide-band phased-arrayantenna module apparatus embodiments.

In an embodiment, the processor 410 has one or more processing cores 412and 412N, where 412N represents the Nth processor core inside processor410 where N is a positive integer. In an embodiment, the electronicdevice system 400 using a system-in-package with a wide-bandphased-array antenna module apparatus embodiment that includes multipleprocessors including 410 and 405, where the processor 405 has logicsimilar or identical to the logic of the processor 410. In anembodiment, the processing core 412 includes, but is not limited to,pre-fetch logic to fetch instructions, decode logic to decode theinstructions, execution logic to execute instructions and the like. Inan embodiment, the processor 410 has a cache memory 416 to cache atleast one of instructions and data for the system-in-package with awide-band phased-array antenna module apparatus in the system 400. Thecache memory 416 may be organized into a hierarchal structure includingone or more levels of cache memory.

In an embodiment, the processor 410 includes a memory controller 414,which is operable to perform functions that enable the processor 410 toaccess and communicate with memory 430 that includes at least one of avolatile memory 432 and a non-volatile memory 434. In an embodiment, theprocessor 410 is coupled with memory 430 and chipset 420. In anembodiment, the chipset 420 is part of a system-in-package with awide-band phased-array antenna module apparatus depicted in FIG. 5. Theprocessor 410 may also be coupled to a wireless antenna 478 tocommunicate with any device configured to at least one of transmit andreceive wireless signals. In an embodiment, the wireless antennainterface 478 operates in accordance with, but is not limited to, theIEEE 802.11 standard and its related family, Home Plug AV (HPAV), UltraWide Band (UWB), Bluetooth, WiMax, or any form of wireless communicationprotocol.

In an embodiment, the volatile memory 432 includes, but is not limitedto, Synchronous Dynamic Random Access Memory (SDRAM), Dynamic RandomAccess Memory (DRAM), RAMBUS Dynamic Random Access Memory (RDRAM),and/or any other type of random access memory device. The non-volatilememory 434 includes, but is not limited to, flash memory, phase changememory (PCM), read-only memory (ROM), electrically erasable programmableread-only memory (EEPROM), or any other type of non-volatile memorydevice.

The memory 430 stores information and instructions to be executed by theprocessor 410. In an embodiment, the memory 430 may also store temporaryvariables or other intermediate information while the processor 410 isexecuting instructions. In the illustrated embodiment, the chipset 420connects with processor 410 via Point-to-Point (PtP or P-P) interfaces417 and 422. Either of these PtP embodiments may be achieved using asystem-in-package with a wide-band phased-array antenna module apparatusembodiment as set forth in this disclosure. The chipset 420 enables theprocessor 410 to connect to other elements in system-in-package with awide-band phased-array antenna module apparatus embodiments in a system400. In an embodiment, interfaces 417 and 422 operate in accordance witha PtP communication protocol such as the Intel® QuickPath Interconnect(QPI) or the like. In other embodiments, a different interconnect may beused.

In an embodiment, the chipset 420 is operable to communicate with theprocessor 410, 405N, the display device 440, and other devices 472, 476,474, 460, 462, 464, 466, 477, etc. The chipset 420 may also be coupledto a wireless antenna 478 to communicate with any device configured toat least do one of transmit and receive wireless signals.

The chipset 420 connects to the display device 440 via the interface426. The display 440 may be, for example, a liquid crystal display(LCD), a plasma display, cathode ray tube (CRT) display, or any otherform of visual display device. In an embodiment, the processor 410 andthe chipset 420 are merged into a system-in-package with a wide-bandphased-array antenna module apparatus in a system. Additionally, thechipset 420 connects to one or more buses 450 and 455 that interconnectvarious elements 474, 460, 462, 464, and 466. Buses 450 and 455 may beinterconnected together via a bus bridge 472 such as at least onesystem-in-package with a wide-band phased-array antenna module apparatusembodiment. In an embodiment, the chipset 420 couples with anon-volatile memory 460, a mass storage device(s) 462, a keyboard/mouse464, and a network interface 466 by way of at least one of the interface424 and 474, the smart TV 476, and the consumer electronics 477, etc.

In an embodiment, the mass storage device 462 includes, but is notlimited to, a solid state drive, a hard disk drive, a universal serialbus flash memory drive, or any other form of computer data storagemedium. In one embodiment, the network interface 466 is implemented byany type of well-known network interface standard including, but notlimited to, an Ethernet interface, a universal serial bus (USB)interface, a Peripheral Component Interconnect (PCI) Express interface,a wireless interface and/or any other suitable type of interface. In oneembodiment, the wireless interface operates in accordance with, but isnot limited to, the IEEE 802.11 standard and its related family, HomePlug AV (HPAV), Ultra Wide Band (UWB), Bluetooth, WiMax, or any form ofwireless communication protocol.

While the modules shown in FIG. 4 are depicted as separate blocks withinthe system-in-package with a wide-band phased-array antenna moduleapparatus embodiment in a computing system 400, the functions performedby some of these blocks may be integrated within a single semiconductorcircuit or may he implemented using two or more separate integratedcircuits. For example, although cache memory 416 is depicted as aseparate block within processor 410, cache memory 416 (or selectedaspects of 416) can he incorporated into the processor core 412.

Where useful, the computing system 400 may have a broadcasting structureinterface such as for affixing the apparatus to a cellular tower.

To illustrate the system-in-package with a wide-band phased-arrayantenna module apparatus embodiments and methods disclosed herein, anon-limiting list of examples is provided herein:

Example 1 is a system in package, comprising: a processor die and aradio-frequency integrated circuit (RFIC) die embedded in asemiconductor device package, wherein the processor die includes anactive surface disposed against a redistribution layer (RDL), whereinthe RFIC die includes a first surface facing opposite the processor diefirst surface; a wide-hand phased-array antenna module mated to thesemiconductor device package, wherein the RFIC die is coupled to thewide-band phased-array antenna module with at least one vertical-lineinterconnect, wherein the vertical-line interconnect is at leastpartially surrounded by grounded voltage source, and wherein the RFICdie is isolated within a through-mold trench.

In Example 2, the subject matter of Example 1 optionally includeswherein the wide-band phased-array antenna module includes asemiconductive core including a plurality of through holes, through onehole of which the vertical-line interconnect is disposed.

In Example 3, the subject matter of any one or more of Examples 1-2optionally include wherein the wide-band phased-array antenna moduleincludes a semiconductive core, wherein the grounded voltage sourceincludes a metallic plating layer that contacts the semiconductive corewithin at least one through hole and on a bottom surface, furtherincluding a first dielectric layer that is disposed on the metallicplating layer at the bottom surface, within the at least one throughhole, and on the semiconductive core at a top surface.

In Example 4, the subject matter of Example 3 optionally includeswherein the at least one vertical-line interconnect is insulated by thefirst dielectric layer within one of the plurality of through holes.

In Example 5, the subject matter of any one or more of Examples 3-4optionally include wherein the at least one vertical-line interconnectis insulated by the first dielectric layer within one of the pluralityof through holes, further including a protection layer that covers adirect-contact antenna pad that contacts the at least one vertical-lineinterconnect.

In Example 6, the subject matter of any one or more of Examples 1-5optionally include wherein the processor die is grounded to a groundedvoltage source structure.

In Example 7, the subject matter of any one or more of Examples 1-6optionally include wherein the at least one vertical-line interconnectcontacts a direct-contact antenna pad.

In Example 8, the subject matter of any one or more of Examples 1-7optionally include wherein the processor die is grounded to the groundedsource structure, wherein the at least one vertical-line interconnectcontacts a direct-contact antenna pad on a first dielectric layer, andfurther including at least one fan-out antenna pad disposed on the firstdielectric layer and coupled to the RFIC die.

In Example 9, the subject matter of any one or more of Examples 1-8optionally include wherein the RFIC die is further isolated by at leastone ground trace disposed between the RFIC die at an RFIC die secondsurface, and the RDL.

In Example 10, the subject matter of any one or more of Examples 1-9optionally include wherein the at least one vertical-line interconnectcontacts a direct-contact antenna pad that is disposed above the RFICfirst surface on a first dielectric layer, and wherein the fan-outantenna pad is disposed above and lateral to the RFIC first surface.

In Example 11, the subject matter of any one or more of Examples 1-10optionally include wherein the direct-contact antenna pad and thefan-out antenna pad are disposed on a first dielectric layer, andwherein the first dielectric layer is covered by a protection layer.

In Example 12, the subject matter of any one or more of Examples 1-11optionally include a board coupled to an electrical bump array disposedon the semiconductor device package on a land side.

In Example 13, the subject matter of any one or more of Examples 1-12optionally include at least one memory module disposed in thesemiconductor device package, a memory-controller hub and a platformcontroller hub.

Example 14 is a method of assembling a wide-band phased-array antenna ina system in package, comprising: embedding a processor die and a radiofrequency integrated circuit (RFIC) die in a semiconductor devicepackage, wherein the processor die is mated at a first surface with aredistribution layer (RDL), and wherein the RFIC die is embedded with afirst surface facing opposite the processor die first surface; forming awide-band phased-array antenna module under conditions to include avertical-line interconnect that is at least partially surrounded with aground-voltage plating layer in a through-hole in a semiconductivesubstrate; and assembling the wide-band phased-array antenna module tothe semiconductor device package under conditions to allow at least onevertical-line interconnect to each contact a maximum of one electricalbump disposed on a bond pad of the RFIC die.

In Example 15, the subject matter of Example 14 optionally includeswherein the processor die and RFIC die are configured side-by-side, andwherein the RFIC die is at least partially surrounded within athrough-mold trench that is formed to laterally surround the RFIC die.

In Example 16, the subject matter of any one or more of Examples 14-15optionally include wherein the wide-band phased-array antenna module isformed with a plurality of vertical-line interconnects that pass throughthe semiconductive substrate, wherein each vertical-line interconnect isat least partially surrounded with the ground-voltage plating layer, andwherein each vertical-line interconnect is insulated with a firstdielectric layer that contacts the semiconductive substrate on a topsurface that is opposite to a bottom surface, and wherein the firstdielectric layer is also formed with the plurality of through-holes.

In Example 17, the subject matter of Example 16 optionally includesforming the ground-voltage plating layer on the top surface of thesemiconductor substrate, within the plurality of through-holes, and onthe bottom surface; and removing the ground-voltage plating layer fromthe top surface; followed by forming the first dielectric layer on thetop surface, within the plurality of through holes, and on the groundvoltage plating layer that covers the bottom surface; and opening theplurality of through holes under conditions to retain the firstdielectric layer on the ground voltage plating in the plurality ofthrough holes; and forming the at least one vertical-line interconnectwithin one of the plurality of through holes.

Example 18 is a computing system, comprising: a processor die and awide-band radio-frequency integrated circuit (RFIC) die embedded in asemiconductor device package, wherein the processor die includes a firstsurface disposed against a redistribution layer (RDL), wherein the RFICdie includes a first surface facing opposite the processor die firstsurface; a wide-band phased-array antenna module mated to thesemiconductor device package, wherein the wide-band phased-array antennamodule includes a semiconductive core, wherein the grounded voltagesource includes a metallic plating layer that contacts thesemiconductive core within at least one through hole and on a bottomsurface, further including a first dielectric layer that is disposed onthe metallic plating layer at the bottom surface, within the at leastone through hole, and on the semiconductive core at a top surface;wherein the RFIC die is coupled to the wide-band phased-array antennamodule with at least one vertical-line interconnect, wherein thevertical-line interconnect is at least partially surrounded by agrounded voltage source structure, and wherein the RFIC die is isolatedwithin a through-mold trench; and a board coupled to an electrical bumparray disposed on the semiconductor device package on a land side, andwherein the board is coupled to an external shell.

In Example 19, the subject matter of Example 18 optionally includeswherein the processor die is grounded to the grounded source, whereinthe at least one vertical-line interconnect contacts a direct-contactantenna pad, and further including at least one fan-out antenna padcoupled to the RFIC.

In Example 20, the subject matter of any one or more of Examples 18-19optionally include wherein the processor die and the RFIC die are partof a chipset that includes a memory module, a memory-controller hub anda platform controller hub.

The above detailed description includes references to the accompanyingdrawings, which form a part of the detailed description. The drawingsshow, by way of illustration, specific embodiments in which theinvention can be practiced. These embodiments are also referred toherein as “examples.” Such examples can include elements in addition tothose shown or described. However, the present inventors alsocontemplate examples in which only those elements shown or described areprovided. Moreover, the present inventors also contemplate examplesusing any combination or permutation of those elements shown ordescribed (or one or more aspects thereof), either with respect to aparticular example (or one or more aspects thereof), or with respect toother examples (or one or more aspects thereof) shown or describedherein.

In the event of inconsistent usages between this document and anydocuments so incorporated by reference, the usage in this documentcontrols.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

Method examples described herein can be machine or computer-implementedat least in part. Some examples can include a computer-readable mediumor machine-readable medium encoded with instructions operable toconfigure, an electrical device to perform methods as described in theabove examples. An implementation of such methods can include code, suchas microcode, assembly language code, a higher-level language code, orthe like. Such code can include computer readable instructions forperforming various methods. The code may form portions of computerprogram products. Further, in an example, the code can be tangiblystored on one or more volatile, non-transitory, or non-volatile tangiblecomputer-readable media, such as during execution or at other times.Examples of these tangible computer-readable media can include, but arenot limited to, hard disks, removable magnetic disks, removable opticaldisks (e.g., compact disks and digital video disks), magnetic cassettes,memory cards or sticks, random access memories (RAMS), read onlymemories (ROMs), and the like.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments can he used, such as by one of ordinary skill in the artupon reviewing the above description. The Abstract is provided to complywith 37 C.F.R. § 1.72(b), to allow the reader to quickly ascertain thenature of the technical disclosure. It is submitted with theunderstanding that it will not be used to interpret or limit the scopeor meaning of the claims. Also, in the above Detailed Description,various features may be grouped together to streamline the disclosure.This should not be interpreted as intending that an unclaimed disclosedfeature is essential to any claim. Rather, inventive subject matter maylie in less than all features of a particular disclosed embodiment.Thus, the following claims are hereby incorporated into the DetailedDescription as examples or embodiments, with each claim standing on itsown as a separate embodiment, and it is contemplated that suchembodiments can be combined with each other in various combinations orpermutations. The scope of the disclosed embodiments should bedetermined with reference to the appended claims, along with the fullscope of equivalents to which such claims are entitled.

1. A method of assembling a wide-band phased-array antenna in a systemin package, comprising: embedding a processor die and a radio frequencyintegrated circuit (RFIC) die in a semiconductor device package, whereinthe processor die is mated at a first surface with a redistributionlayer (RDL), and wherein the RFIC die is embedded with a first surfacefacing opposite the processor die first surface; forming a wide-bandphased-array antenna module under conditions to include a vertical-lineinterconnect that is at least partially surrounded with a ground-voltageplating layer in a through-hole in a semiconductive substrate; andassembling the wide-band phased-array antenna module to thesemiconductor device package under conditions to allow at least onevertical-line interconnect to each contact a maximum of one electricalbump disposed on a bond pad of the RFIC die.
 2. The method of claim 1,wherein the processor die and RFIC die are configured side-by-side, andwherein the RFIC die is at least partially surrounded within athrough-mold trench that is formed to laterally surround the RFIC die.3. The method of claim 1, wherein the wide-band phased-array antennamodule is formed with a plurality of vertical-line interconnects thatpass through the semiconductive substrate, wherein each vertical-lineinterconnect is at least partially surrounded with the ground-voltageplating layer, and wherein each vertical-line interconnect is insulatedwith a first dielectric layer that contacts the semiconductive substrateon a top surface that is opposite to a bottom surface, and wherein thefirst dielectric layer is also formed with the plurality ofthrough-holes.
 4. The method of claim 3, further including: forming theground-voltage plating layer on the top surface of the semiconductorsubstrate, within the plurality of through-holes, and on the bottomsurface; and removing the ground-voltage plating layer from the topsurface; followed by forming the first dielectric layer on the topsurface, within the plurality of through holes, and on the groundvoltage plating layer that covers the bottom surface; and opening theplurality of through holes under conditions to retain the firstdielectric layer on the ground voltage plating in the plurality ofthrough holes; and forming the at least one vertical-line interconnectwithin one of the plurality of through holes.
 5. The method of claim 1,wherein the redistribution layer includes an electrical bump array,further including: mating a hoard coupled to the electrical bump arraydisposed on the semiconductor device package on a land side.
 6. Themethod of claim 5, further including coupling the board to an externalshell.
 7. The method of claim 1, further including coupling theprocessor die and the RFIC die to a chipset that includes a memorymodule, a memory-controller hub and a platform controller hub.
 8. Themethod of claim 1, further including forming a through-mold trench toform a shielding wall to separate the RFIC die from the processor die,and from a memory module.
 9. A method of assembling a wide-bandphased-array antenna in a system in package, comprising: locating aprocessor die and a radio frequency integrated circuit (RFIC) die in asemiconductor device package, wherein the processor die includes a firstsurface transistor active area coupled to a redistribution layer (RDL),and wherein the RFIC die is embedded with a first surface transistoractive area facing opposite the processor die first surface transistoractive area; and assembling a wide-band phased-array antenna module tothe semiconductor device package under conditions to allow at least onevertical-line interconnect to each contact a maximum of one electricalbump disposed on a bond pad of the RFIC die.
 10. The method of claim 9,further including forming the wide-band phased-array antenna moduleunder conditions to include the at least one vertical-line interconnectto be at least partially surrounded with a ground-voltage plating layerin a through-hole in a semiconductive substrate.
 11. The method of claim9, wherein the processor die and RFIC die are configured side-by-side,and wherein the RFIC die is at least partially surrounded within athrough-mold trench that is formed to laterally surround the RFIC die.12. The method of claim 11, further including forming the wide-bandphased-array antenna module under conditions to include the at least onevertical-line interconnect to be at least partially surrounded with aground-voltage plating layer in a through-hole in a semiconductivesubstrate.
 13. The method of claim 12, wherein the wide-bandphased-array antenna module is formed with a plurality of vertical-lineinterconnects that pass through the semiconductive substrate, whereineach vertical-line interconnect is at least partially surrounded withthe ground-voltage plating layer, and wherein each vertical-lineinterconnect is insulated with a first dielectric layer that contactsthe semiconductive substrate on a top surface that is opposite to abottom surface, and wherein the first dielectric layer is also formedwith the plurality of through-holes.
 14. The method of claim 13, furtherincluding: forming the ground-voltage plating layer on the top surfaceof the semiconductor substrate, within the plurality of through-holes,and on the bottom surface; and removing the ground-voltage plating layerfrom the top surface; followed by forming the first dielectric layer onthe top surface, within the plurality of through holes, and on theground voltage plating layer that covers the bottom surface; and openingthe plurality of through holes under conditions to retain the firstdielectric layer on the ground voltage plating in the plurality ofthrough holes; and forming the at least one vertical-line interconnectwithin one of the plurality of through holes.
 15. The method of claim 9,wherein the redistribution layer includes an electrical bump array,further including: mating a board coupled to the electrical bump arraydisposed on the semiconductor device package on a land side.
 16. Themethod of claim 15, further including wherein coupling the board to anexternal shell.
 17. The method of claim 9, further including couplingthe processor die and the RFIC die to a chipset that includes a memorymodule, a memory-controller hub and a platform controller hub.
 18. Amethod comprising: forming a processor die and a radio-frequencyintegrated circuit (RFIC) die to be embedded in a semiconductor devicepackage, wherein the processor die includes a first surface transistoractive area disposed against a redistribution layer (RDL), wherein theRFIC die includes a first surface transistor active area facing oppositethe processor die first surface; assembling a wide-band phased-arrayantenna module to the semiconductor device package, wherein the RFIC dieis coupled to the wide-band phased-array antenna module with at leastone vertical-line interconnect, wherein the vertical-line interconnectis at least partially surrounded by a grounded voltage source, andwherein the RFIC die is isolated within a through-mold trench; andmating a board to be coupled to an electrical bump array disposed on thesemiconductor device package on a land side of the RDL.
 19. The methodof claim 18, further including: assembling the processor die and theRFIC die to a computing system that includes a chipset with at least twoof a memory module, a memory controller hub, and a platform controllerhub, and wherein the processor die, the RFIC die and the memory moduleare embedded in the semiconductor device package, and wherein thewide-band phased-array antenna module to the semiconductor devicepackage is assembled opposite the RDL.
 20. The method of claim 19,further including assembling a board with an external shell.